第24届IEEE晶片系统国际会议(SOCC)
第24届IEEE晶片系统国际会议(SOCC)
英文名称：24thIEEEInternationalSoCConference(SOCC)
会议时间：2011/9/26~2011/9/28
会议地点：GrandHotel
会议行业：工业制造
第24届IEEE晶片系统国际会议(SOCC)会议背景：
SystemonChip(SoC)hasbeentheenablingtechnologybehindtheevolutionofmanyoftoday’subiquitoustechnologies,suchasInternet,mobilewirelesstechnology,andhighdefinitiontelevision.Theinformationtechnologyage,inturn,hasfuelledaglobalcommunicationsrevolution.SoCdevicestodayincludesomeorallofthemajorelectronicstechnologies,comprisingRF,analog,optical,digital,andNano‐Electro‐MechanicalSystems(NEMS).Recentadvancesinsystems,deep‐submicronandnanoprocesstechnologyareunleashingnewopportunities,butalsocreatingnewchallenges.Managementsofdesignandverificationcomplexity,EDAtools,on‐chipcommunication,anddesignreuseforSoCsaresignificantcomplications,andSoCfaultdetectionisbecomingmoredifficultaschipsizeisincreasing.
TheSOCConferenceisapremierforumforsharingadvancesinSoCtechnologiesandapplicationsintheareasofdigitalsystems,circuitarchitectures,designmethods,tools,automation,manufacturing,test,andemergingtechnologies.The24thSOCCwillbeheldinTaipei,Taiwan,andwillofferthreedaysoftechnicalpapers,technicalworkshops,andavendorexhibition.Forupdates,pleasecheckourwebsiteregularlyhttp://www.ieee‐socc.orgorfollowusontwitter“@ieee_socc”(orhttp://twitter.com/ieee_socc).
第24届IEEE晶片系统国际会议(SOCC)征文要求：
PapersareinvitedwhichaddressnewandpreviouslyunpublishedresultsintheareaofSystemsonChip,andrelatedtopics.
•Analog,Mixed‐Signal,andBiomedicalCircuitsandSystems
•WirelineandWirelessCommunicationCircuitsandSystems
•DigitalSignalProcessing(DSP)CircuitsandSystems(Video,Multimedia,Software‐DefinedRadio,etc.)
•GreenCircuits,Systems,andDesignMethodologies
•EmbeddedSystems,Multi/ManyCoreSystemsandEmbeddedMemoryTechnologies
•NetworkonChip(NoC),Interconnects,and3D‐IC
•ReconfigurableandProgrammableCircuitsandSystems,SystemonProgrammableDevices(FPGAs)
•SystemLevelDesignMethodology,EDAandDesignToolsforSoC
•SignalIntegrity,DesignforTestability,andDesignVerification
•DesignforManufacturability,Variation‐AwareMethodologies
第24届IEEE晶片系统国际会议(SOCC)联系方式：
地址：IEEESOCConference19803LaurelValleyPlaceMontgomeryVillage,MD20866,USA
Email：info@ieee-socc.org
原文地址：
http://www.haozhanhui.com/meeting/372.html
会议时间：2011/9/26~2011/9/28
会议地点：GrandHotel
会议行业：工业制造
第24届IEEE晶片系统国际会议(SOCC)会议背景：
SystemonChip(SoC)hasbeentheenablingtechnologybehindtheevolutionofmanyoftoday’subiquitoustechnologies,suchasInternet,mobilewirelesstechnology,andhighdefinitiontelevision.Theinformationtechnologyage,inturn,hasfuelledaglobalcommunicationsrevolution.SoCdevicestodayincludesomeorallofthemajorelectronicstechnologies,comprisingRF,analog,optical,digital,andNano‐Electro‐MechanicalSystems(NEMS).Recentadvancesinsystems,deep‐submicronandnanoprocesstechnologyareunleashingnewopportunities,butalsocreatingnewchallenges.Managementsofdesignandverificationcomplexity,EDAtools,on‐chipcommunication,anddesignreuseforSoCsaresignificantcomplications,andSoCfaultdetectionisbecomingmoredifficultaschipsizeisincreasing.
TheSOCConferenceisapremierforumforsharingadvancesinSoCtechnologiesandapplicationsintheareasofdigitalsystems,circuitarchitectures,designmethods,tools,automation,manufacturing,test,andemergingtechnologies.The24thSOCCwillbeheldinTaipei,Taiwan,andwillofferthreedaysoftechnicalpapers,technicalworkshops,andavendorexhibition.Forupdates,pleasecheckourwebsiteregularlyhttp://www.ieee‐socc.orgorfollowusontwitter“@ieee_socc”(orhttp://twitter.com/ieee_socc).
第24届IEEE晶片系统国际会议(SOCC)征文要求：
PapersareinvitedwhichaddressnewandpreviouslyunpublishedresultsintheareaofSystemsonChip,andrelatedtopics.
•Analog,Mixed‐Signal,andBiomedicalCircuitsandSystems
•WirelineandWirelessCommunicationCircuitsandSystems
•DigitalSignalProcessing(DSP)CircuitsandSystems(Video,Multimedia,Software‐DefinedRadio,etc.)
•GreenCircuits,Systems,andDesignMethodologies
•EmbeddedSystems,Multi/ManyCoreSystemsandEmbeddedMemoryTechnologies
•NetworkonChip(NoC),Interconnects,and3D‐IC
•ReconfigurableandProgrammableCircuitsandSystems,SystemonProgrammableDevices(FPGAs)
•SystemLevelDesignMethodology,EDAandDesignToolsforSoC
•SignalIntegrity,DesignforTestability,andDesignVerification
•DesignforManufacturability,Variation‐AwareMethodologies
第24届IEEE晶片系统国际会议(SOCC)联系方式：
地址：IEEESOCConference19803LaurelValleyPlaceMontgomeryVillage,MD20866,USA
Email：info@ieee-socc.org
原文地址：
http://www.haozhanhui.com/meeting/372.html